| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder coating unit excellent in workability and quality of solder application, and a die bonder. <P>SOLUTION: While a first point P1 of a substrate 1' is stopped just below a solder wire 2 supported by a solder supply unit 4, the solder wire 2 is let out down below at a constant speed so that the end of the wire is brought in contact and melted with the first point P1. In succession, the whole solder supply unit 4 is horizontally moved in a direction parallel to the coated surface of the substrate 1' by a drive control system 20 to successively melt the solder wire 2 bit by bit from its end on the substrate 1', and the melted solder 2d is applied to the coated surface of the substrate 1' in a horizontal and approximately elliptical shape. If the solder wire 2 is moved as far as a second point P2, the solder wire 2 is pulled up to finalize the one-stroke solder application operation on the substrate. <P>COPYRIGHT: (C)2008,JPO&INPIT |
