| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alkali developable one-part photosensitive resin composition capable of forming a dry film type solder resist excellent in cracking resistance and having satisfactory HAST resistance. <P>SOLUTION: The preferred photosensitive resin composition comprises (a) a binder polymer having carboxyl groups, (b) a photopolymerizable monomer having at least one ethylenically unsaturated group, (c) a polyurethane compound and (d) a photopolymerization initiator, wherein the polyurethane compound (c) is obtained by reacting an epoxy acrylate compound having two or more hydroxyl groups and an ethylenically unsaturated group with a diisocyanate compound and a diol compound having a carboxyl group. <P>COPYRIGHT: (C)2008,JPO&INPIT |
