THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE COMPOSITION, THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET-FORM MOLDED BODY, MANUFACTURING METHOD OF THESE, AND ELECTRONIC COMPONENT

摘要

This mixed composition contains 100 parts by mass of a (meth)acrylate resin composition (A) containing (meth)acrylate acid ester polymers (A1) and (meth)acrylate acid ester monomers (alpha1), 90-1200 parts by mass of a thermally conductive filler (B), 0.2-8 parts by mass of polyfunctional monomers (D) having multiple polymerizable unsaturated bonds, and 0.3-5.0 parts by mass of a polyfunctional epoxy compound (E) having 2 to 10000 functional groups and a viscosity at 25°C of 600mPa*s or less. This composition is characterized by performing a polymerization reaction between the (meth)acrylate acid ester monomers (alpha1) and the polyfunctional monomers (D), and a crosslinking reaction of the (meth)acrylate acid ester polymers (A1) and/or polymers containing structural units derived from the (meth)acrylate acid ester monomers (alpha1).