| 摘要 |
PROBLEM TO BE SOLVED: To provide a silicon wafer reproduction system which can easily, efficiently remove and reproduce a pattern of a silicon wafer, and to provide its method. SOLUTION: The reproduction system includes a grid blaster ejecting a grid onto the surface of the silicon wafer, a catching means which catches a chip produced from the silicon wafer, the grid, and a powder containing dust produced from the silicon wafer and grid, a cyclone separating means which is connected to the catching means, separate the dust from the chip and grid supplied from the catching means and discharge, and resupplies the chip and grid separated from the dust to the grid blaster, a dust collecting means which is connected to the cyclone separating means and collects the dust discharged from the cyclone separating means, and destacker which is located to be able to continuously load the silicon wafer upstream of a mesh conveyer one by one. COPYRIGHT: (C)2008,JPO&INPIT
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