发明名称 |
Semiconductor Device And Method Of Manufacturing Thereof |
摘要 |
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable liquid silicone composition that fills the spaces between the mold and the unsealed semiconductor device to compression molding under a predetermined molding temperature, wherein the curable liquid silicone composition has viscosity of 90 Pa.s or less at room temperature, a time interval from the moment directly after measurement of a torque with a curometer at the molding temperature to the moment when the torque reached 1 kgf.cm being not less than 1 min., while the time<img id="custom-character-00001" he="7.53mm" wi="135.93mm" file="US20070273050A1-20071129-P00999.TIF" img-content="character" img-format="tif"/> |
申请公布号 |
US2007273050(A1) |
申请公布日期 |
2007.11.29 |
申请号 |
US20050599041 |
申请日期 |
2005.03.08 |
申请人 |
DOW CORNING TORAY COMPANY, LTD. |
发明人 |
MORITA YOSHITSUGU;NAKANISHI JUNJI;MINE KATSUTOSHI |
分类号 |
H01L23/29;H01L21/56;H01L23/31 |
主分类号 |
H01L23/29 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|