LIQUID PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a liquid processing apparatus which can control scattering of the mist of process liquid to a substrate. SOLUTION: The liquid processing apparatus includes: a substrate holding member 1 configured to rotate along with a substrate W wherein the substrate W is held in a horizontal state; a rotary cup 3 configured to surround the substrate W held on the substrate holding member 1 and to rotate along with the substrate W; a motor 2 configured to integrally rotate the rotary cup 3 and the substrate holding member 1; a surface process liquid supply nozzle 4 configured to supply a process liquid onto the substrate W; an exhaust/drain section 6 configured to perform gas-exhausting and liquid-draining of the rotary cup 3; and a guide material 35 configured to guide the process liquid supplied to the wafer surface and shaken off by the wafer W from the rotation cup 3 via the surface to the exhaust/drain section 6, which is arranged in exterior of the wafer so that its front surface may carry out almost contiguity with the wafer front surface and which rotates along with the substrate holding member 1 and the rotary cup 3. COPYRIGHT: (C)2008,JPO&INPIT