PACKAGING ANTENNAS WITH INTEGRATED CIRCUIT CHIPS

摘要

Apparatus and methods are provided for integrally packaging semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame structures (e.g., lead frame, package carrier, package core, etc.), to thereby form compact integrated radio/wireless communications systems for millimeter wave applications. For example, an electronic apparatus (30) includes a package frame (11) having an antenna (12) that is integrally formed as part of the package frame (11), an IC (integrated circuit) chip (13) mounted to the package frame (11), interconnects (19) that provide electrical connections to the IC chip (13) and the antenna (12), and a package cover (15).