发明名称 |
Integrated Circuit, a Method and an Assembly for Manufacturing the Integrated Circuit, and a Mobile Phone Having the Integrated Circuit |
摘要 |
In an example embodiment, an integrated circuit comprises an on-chip electronic component. The on-chip electronic component has an active surface in a hermetically sealed cavity and a cover to hermetically seal the cavity. There is an additional electronic component wherein the additional electronic component is fixed on the cover.
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申请公布号 |
US2007274058(A1) |
申请公布日期 |
2007.11.29 |
申请号 |
US20050578502 |
申请日期 |
2005.04.04 |
申请人 |
KONINKLIJKE PHILIPS ELECTRONIC N.V. |
发明人 |
COUSIN ALAIN |
分类号 |
H05K7/00;H01F17/00;H01L23/10;H01L23/66;H01L25/065;H01L25/16;H03H9/05 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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