发明名称 |
Solid-state image sensing device and manufacturing method thereof |
摘要 |
Pixel portions each of which has a charge storage portion formed in a semiconductor substrate 11 and a transfer gate for transferring charges stored in the charge storage portion are isolated from each other by a device isolation region in the semiconductor substrate. A buried gate electrically connected to the transfer gate is embedded in the device isolation region. The buried gate includes a gate dielectric film and gate electrode formed in a trench of the semiconductor substrate.
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申请公布号 |
US2007272958(A1) |
申请公布日期 |
2007.11.29 |
申请号 |
US20070700000 |
申请日期 |
2007.01.31 |
申请人 |
MISAKI MAKOTO;TSUTSUI MASAFUMI |
发明人 |
MISAKI MAKOTO;TSUTSUI MASAFUMI |
分类号 |
H01L31/113;H01L27/146;H04N5/335;H04N5/341;H04N5/357;H04N5/369;H04N5/372;H04N5/374 |
主分类号 |
H01L31/113 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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