| 摘要 |
A system-on-chip semiconductor structure. The system-on-chip semiconductor structure comprises a substrate, a low voltage device, a middle voltage device, at least one high voltage device and a plurality of isolation structures. The substrate has a low voltage circuit region and a high voltage circuit region. The low voltage device is located on the low voltage circuit region of the substrate. The middle voltage device is located on the low voltage circuit region of the substrate. The high voltage device is located on the high voltage circuit region of the substrate. The isolation structures are located in the substrate for isolating the low voltage device, the middle voltage device and the high voltage device from each other.
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