Herstellungsverfahren für akustische Oberflächenwellenanordnungen

摘要

A method of manufacturing a surface acoustic wave apparatus includes the steps of bump-bonding a surface acoustic wave element (20) and a base member (10) together through metal bumps (51) having a melting point of about 450 DEG C or higher such that the surface acoustic wave element (20) is fixed in a face down configuration to a bottom surface of a recess of the base member (10); and bonding a cap member (30) and the base member (10) with a wax material (20) by heating the cap member (30) and the base member (10) uniformly at a temperature higher than a melting point of the wax material to melt the wax material.