| 摘要 |
PROBLEM TO BE SOLVED: To provide a transfer method for substrate which is suitably used for a vacuum processing device for performing manufacture or dry etching, etc. for a vapor phase film or an evaporated film, and by which dust is prevented from sticking to a substrate when the substrate is transferred between substrate storage devices for storing a plurality of substrates, so that particles are hard to interfuse when a film is formed on the substrate, and to provide a substrate processing device. SOLUTION: A plurality of substrates are transferred among three or more substrate storage devices for storing them, in this substrate transfer method. At transfer between a first substrate storage device and a second substrate storage device, substrates are taken out from the first substrate storage device, and then they are taken in order from an upper stage while lifting a shelf-like holder of the second substrate storage device. At transfer between the second substrate storage device and a third substrate storage device, substrates are taken out in order from a lower stage while lowering the shelf-like holder of the second substrate storage device, and then they are taken in to the third substrate storage device. COPYRIGHT: (C)2008,JPO&INPIT
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