| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive member suppressed in reduction of adhesive strength with a support member for mounting a semiconductor element in preserving at 25±2°C in assumption of environment such as a clean room and the like and eliminating decomposition products under high temperatures, that has been problems of adhesive compositions for adhering semiconductor elements, a semiconductor device using the same and a method for producing thereof. SOLUTION: The adhesive member is equipped with an adhesive agent layer 2 and a base material layer 1. The adhesive agent layer comprises a resin composition comprising (A) an epoxy resin and an epoxy resin curing agent, (B) a high molecular component containing a functional monomer and having≥100,000 weight average molecular weight, (C) a radioactive ray-polymerizing compound containing≥1 unsaturated bonds and a photoinitiator. In the adhesive member, the photoinitiator contains (D) a proton donating compound and (E) a photoacid generator. COPYRIGHT: (C)2008,JPO&INPIT
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