BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECTRONIC DEVICE
摘要
<p>A bonding material which has a melting temperature of 270°C or higher and does not contain lead is provided at a low cost. An electronic element and an electrode of an electronic component are bonded by using the bonding material including an alloy having Bi as a main component. The alloy contains a Cu of 0.2-0.8 wt% and a Ge of 0.02-0.2 wt%.</p>
申请公布号
WO2007136009(A1)
申请公布日期
2007.11.29
申请号
WO2007JP60267
申请日期
2007.05.18
申请人
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;FURUSAWA, AKIO;SUETSUGU, KENICHIRO;SAKAGUCHI, SHIGEKI;NAKAYA, KIMIAKI
