发明名称 THIN FILM ELEMENT AND ITS FABRICATION PROCESS, THIN FILM CIRCUIT DEVICE AND ITS FABRICATION PROCESS, AND ELECTRONIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a thin film element in which connection reliability can be enhanced by preventing short circuit of a connection line; and to provide its fabrication process, a thin film circuit device and its fabrication process, and an electronic apparatus equipped with the thin film circuit device. SOLUTION: The thin film element 10a has a connection terminal 13 which is connected electrically with the outside through a connection line wherein a trench 14 for containing a portion of the connection line is provided from the connection terminal 13 to the end of the element. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007305622(A) 申请公布日期 2007.11.22
申请号 JP20060129323 申请日期 2006.05.08
申请人 SEIKO EPSON CORP 发明人 KODAIRA YASUAKI;KUROSAWA HIROFUMI
分类号 H01L23/12 主分类号 H01L23/12
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