| 摘要 |
An organic light emitting display device and a method for manufacturing the same are provided to reduce an exfoliation between a protection thin film layer, an organic light emitting layer and a substrate by forming an area of a hardness reinforcing layer relatively larger than the protection thin film layer. An organic light emitting display device includes a substrate(110), a buffer layer(120), a semiconductor layer(130), a gate insulation layer(140), a gate electrode(150), an inter-layer insulation layer(160), a source/drain electrode(170), an insulation layer(180), an organic light emitting layer(190), a protection thin film layer(210), and a hardness reinforcing layer(220). The buffer layer is formed on an upper plane of the substrate. The semiconductor layer is formed on an upper plane of the buffer layer. The gate insulation film is formed on an upper plane of the semiconductor layer. The gate electrode is formed on an upper plane of the gate insulation film. The inter-layer insulation layer is formed on an upper plane of the gate electrode. The source/drain electrode is formed on an upper plane of the inter-insulation film, and has a conducting contact which is electrically connected to the semiconductor layer. The insulation layer is formed on an upper plane of the source/drain electrode. The organic light emitting layer is formed on an upper plane of the insulation layer, and has a conducting via which is electrically connected to the source/drain electrode. The protection thin film layer is formed on an upper plane of the organic light emitting layer. The hardness reinforcing layer is formed on an upper plane of the protection thin film layer. |
