| 摘要 |
PROBLEM TO BE SOLVED: To provide a coin type electrochemical element which is downsized and highly hermetic, which is capable of responding to a reflow process of a lead-free solder, and which is high in heat resistance, and its manufacturing method. SOLUTION: Disc-like electrodes containing electrode active materials are oppositely arranged with a separator pinched, a frame-like gasket by nonconductive rubber is formed at the side face part of that electrode, an outer packaging material of directions of the upper and the lower faces of that electrode is formed by conductive rubber, and after injection of an electrolytic solution, the inner cell in which that conductive rubber and the nonconductive rubber are vulcanized and bonded and sealed is fabricated, and a contact part between the nonconductive rubber of the outer packaging side face of the laminated inner cell 12 and metallic coin cases (cap 11, case 14) and an insulating packing 13 is vulcanized and bonded by using a vulcanizing adhesive. Moreover, after caulking and sealing the metallic coin cases, rubber for outer packaging of the inner cell 12 is completely vulcanized. COPYRIGHT: (C)2008,JPO&INPIT
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