| 摘要 |
PROBLEM TO BE SOLVED: To etch the edge of a wafer uniformly by preventing the leakage of an etching liquid to the lower surface of the wafer. SOLUTION: While rotating a single thin disklike silicon wafer 11 mounted to a wafer chuck 12 horizontally, the upper surface of the wafer is etched by supplying the etching liquid 14 thereto. A groove 27a for storing the etching liquid 14 flowing downward from the upper surface of the wafer 11 along the edge 11a of the wafer 11 is formed in a chuck 12 to oppose the edge 11a of the wafer 11; and a doughnut-like adhesion form 28 is provided in the chuck 12 having an upper surface adhering to the periphery of the lower surface of the wafer 11 mounted to the wafer chuck 12, and preventing the leakage of the etching liquid 14 stored in the groove 27a to the lower surface of the wafer 11. The outside diameter B of the adhesion form 28 is smaller by 6-0.2 mm than the outside diameter A of the silicon wafer 11. COPYRIGHT: (C)2008,JPO&INPIT
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