| 摘要 |
A substrate, and a semiconductor die package formed therefrom, are disclosed which include a distributed plating pattern for reducing mechanical stress on the semiconductor die. The substrate according to embodiments of the invention may include traces and contact pads plated in a double image plating process. Additionally, the substrate may include dummy plating areas including plating material. The plated vias and/or traces and the plating material within the dummy plating areas provide a plating pattern which is evenly distributed across the surface of the substrate. The even distribution of the plating pattern prevents peaks and valleys in the finished substrate.
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