| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing printed boards for formation of fine circuits including inexpensive successive processes of precise planarizing processing which can be applied to a large area and actualizes fine circuit patterns economically. SOLUTION: The method comprises a step (S201) of providing a printed board on whose at least one side a dielectric layer having an incised pattern for formation of a circuit including via holes and lines is formed, a step (S202) of forming a metal layer on the dielectric layer so that it includes the incised pattern up to an predetermined excessive thickness on it, a step (S203) of removing a part of the excessive metal layer on the dielectric layer by means of mechanical polishing, and a step (S204) of forming a circuit by removing residual excessive metal layer on the dielectric layer with chemical etching. COPYRIGHT: (C)2008,JPO&INPIT |
