SEMICONDUCTOR DEVICE AND ELECTRONIC EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device that facilitates incorporation of a serial interface circuit, and electronic equipment. SOLUTION: The semiconductor device includes a first semiconductor chip and a second semiconductor chip which has a high-speed serial I/F circuit transferring serial data to an external device through a serial bus and is stacked on the first semiconductor chip. A pad area 81 where a pad (electrode) for connecting the external device to the high-speed serial I/F circuit is disposed is provided along a side SB1 which is the short side of the second semiconductor chip. A pad area 82 where a pad for connecting an internal circuit that the first semiconductor chip includes to the high-speed serial I/F circuit is disposed is provided along a side SB2 which is the long side of the second semiconductor chip. Transmitter circuits TX0 to TX2 (or receiver circuits) for data transfer that a physical-layer circuit 40 includes and a transmitter circuit TCK (or a receiver circuit) for clock transfer are disposed along the side SB1. COPYRIGHT: (C)2008,JPO&INPIT