SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND ITS PACKAGING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit device in which a good fillet is formed even at a corner portion. SOLUTION: In a semiconductor integrated circuit device where a semiconductor element 1 is flip-chip mounted on a wiring board 2 and fastened thereon by sealing resin 5, protrusions 7a-7d protruding toward the wiring board 2 side are formed on the back side of the semiconductor element 1 to extend along the sides 1a-1d thereof on the inside of the electrode 3 of the semiconductor element 1. COPYRIGHT: (C)2008,JPO&INPIT