| 摘要 |
PROBLEM TO BE SOLVED: To provide a shell by which the reliability of a semiconductor element is evaluated and tested quickly, efficiently, and highly reliably on a wafer level. SOLUTION: The shell has a thermal resistance substrate and a conductor circuit in which a connecting pad portion is formed on the thermal resistance substrate, and is used when evaluating and testing the reliability at a temperature of 160°C or more. The shell has a contactor 11 in which a coefficient of thermal expansion of the thermal resistance substrate is 1-50 ppm/°C, and a wafer holder 32. When testing the reliability, a wafer W is laid on the wafer holder 32, in the state where the connecting pad portion of the contactor 11 and an electrode pad of the wafer W are collectively brought into contact, the wafer holder 32, the wafer W and the contactor 11 are integrated. COPYRIGHT: (C)2008,JPO&INPIT
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