发明名称 Base of a circuit board with a heat dissipating capability
摘要 A base for a circuit board has a body made of metal material with a high heat conduction and an isolated heat conduction layer mounted on the body for preventing short circuit from occurring. Hence, the heat-generated by an electrical component can be effectively dissipated via the isolated heat conduction layer.
申请公布号 US2007267216(A1) 申请公布日期 2007.11.22
申请号 US20060435086 申请日期 2006.05.16
申请人 KUO LI-WEI 发明人 KUO LI-WEI
分类号 H05K1/00 主分类号 H05K1/00
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