发明名称 METHOD FOR MICROPACKAGING OF LEDS AND MICROPACKAGE
摘要 A micropackage including a substrate composed of a flexible plastic material having laminated on opposite sides thereof films of a conductive metal. A cavity is formed in the substrate with the laminated film on a first side having at least one tab projecting into the cavity. An LED having a first contact is positioned in the cavity of the substrate with the tab bonded to the first contact. The LED has a second contact that is bonded to one of the film on the opposite, second side of the substrate and a second tab defined by the film on the first side of the substrate. A dome of transparent material is adhered to the first side of the substrate covering the LED on the first side of the substrate. A method for making the micropackage. A data display using the micropackage, and a method of making the data display.
申请公布号 EP1856733(A2) 申请公布日期 2007.11.21
申请号 EP20050807250 申请日期 2005.09.28
申请人 AGILIGHT, INC. 发明人 GREGORY, JOHN
分类号 H01L23/00;B23K26/36;H01L33/62 主分类号 H01L23/00
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