| 摘要 |
PROBLEM TO BE SOLVED: To laminate brazing material, by plating, for jointing a cap to seal a chip placed on a board. SOLUTION: A base material plating layer 26 and a gold plating layer 28 are sequentially formed by electroless plating on a board wiring pattern 24 on a board 12. Then, a gold-tin plating layer 30 is formed by electrolytic plating by applying a voltage to a cap jointing pattern part 34. Here, such bonding pat pattern 32 as no voltage is applied is not plated. A cap 20 is jointed by brazing with a gold-tin alloy plated selectively on the cap jointing pattern 34 as a solder. COPYRIGHT: (C)2006,JPO&NCIPI |
