APPARATUS AND METHOD FOR TREATING SUBSTRATE

摘要

A substrate treating apparatus and a method for treating a substrate are provided to minimize generation of process errors from a part of a wafer and to suppress excessive rotation of a supporting member. A plate(10) has a rotatable structure and supports a substrate. A processing liquid supply unit(50) supplies a processing liquid onto the substrate loaded on the plate. A plurality of supporting members(20) are installed on an upper surface of the plate. The supporting members come in contact with a lateral part of the substrate in order to prevent ejection of the substrate from the plate. A plurality of driven shafts(30) are connected to lower parts of the supporting members. A driving member(40) is formed to rotate the driven shafts. A control unit(60) controls the driving member in order to rotate the supporting members while the processing liquid is supplied onto the substrate.