| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder coating device that dispenses with substrate turnover after lead insertion, discrete component press, and masking to non-soldering section, cannot easily become large mechanically, and copes with substrate types suitably, and to provide a fluid coating device utilizing the solder coating device. SOLUTION: The solder coating device 100 inserts a lead 110 of a discrete component 108 into a substrate 109 and then coats the lead projecting from the substrate with solder. The solder coating device 100 comprises: a cream solder coating module 102 that stores cream solder, rotates a solder coating nozzle for adhering the cream solder to the tip of a solder coating nozzle, and approaches the lead projecting from the substrate fixed to the solder coating device from a horizontal direction to come into contact with the tip of the solder coating nozzle for applying the cream solder adhering to the tip of the solder coating nozzle; a biaxial robot mechanism 101 for moving the cream solder coating module in the directions of the two axes of X and Y to the lead projecting from the substrate; and a solder coating device control section 201 for controlling the drive of the two axes of X and Y, of the biaxial robot mechanism and the rotation of the solder coating nozzle of the cream solder module. COPYRIGHT: (C)2008,JPO&INPIT |
