| 摘要 |
PROBLEM TO BE SOLVED: To find out a processing step which complies fully with the requirements for quality of semiconductor wafers and which is also economical. SOLUTION: Semiconductor wafers are cut from a crystal and subjected to a series of processing steps in which material is removed from a front side and a rear side of the semiconductor wafers, and the disclosed method includes following processing steps of: a mechanical processing step; an etching step for oxidizing semiconductor wafers and removing the material at a temperature from 20 to 70°C from the front side of the semiconductor wafers using a gas-state etchant containing hydrogen fluoride; and a polishing step of polishing the front side of the semiconductor wafers. In the processing step of polishing the front side of the semiconductor wafers, the material of 5μm or less as a whole is removed. COPYRIGHT: (C)2008,JPO&INPIT
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