WAFER PROCESSING SYSTEM AND METHOD OF MANUFACTURING WAFERS
摘要
Described is a method for manufacturing wafers and a manufacturing system (11) in which the footprint is substantially contained in a size approximating the processing chambers (17, 18). Single wafers move horizontally through the system and processing occurs simultaneously in groups of processing chambers. Various manufacturing processes employed in making semiconductor wafers are included as processing chambers in the system.
申请公布号
WO2006055236(A3)
申请公布日期
2007.11.15
申请号
WO2005US39433
申请日期
2005.10.31
申请人
INTEVAC, INC.
发明人
FAIRBAIRN, KEVIN, P.;PONNEKANTI, HARI;LANE, CHRISTOPHER;WEISS, ROBERT, EDWARD;LATCHFORD, IAN;BLUCK, TERRY