| 摘要 |
To prevent particles from generating by reducing a contact-gas area and improve a purge efficiency by reducing a flow passage capacity. There is provided a substrate processing apparatus, comprising a processing chamber 1 for processing a substrate 2 ; a substrate carrying port 10 provided on a sidewall of the processing chamber 1 , for carrying-in/carrying-out the substrate 2 to/from the processing chamber 1 ; a holder provided so as to be lifted and lowered in the processing chamber 1 , for holding the substrate 2 ; supply ports 3 and 4 provided above the holder, for supplying gas into the processing chamber 1 ; an exhaust duct 35 provided on the peripheral part of the holder, for exhausting the gas supplied into the processing chamber 1 ; and an exhaust port 5 provided below an upper surface of the exhaust duct 35 when the substrate is processed, for exhausting the gas discharged by the exhaust duct 35 outside the processing chamber 1 , wherein at least a part of a member constituting the exhaust duct 35 is provided so as to be lifted and lowered.
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