发明名称 SOLDERING APPARATUS
摘要 An automatic soldering apparatus is provided to control separately a transfer speed of a printed circuit board in a preheating section and a soldering section by separately controlling first and second conveyors, and to control a transfer speed of the first and second conveyors without lengthening an entire length of the automatic soldering apparatus. An automatic soldering apparatus includes a preheating unit(30) for preheating a printed circuit board(1), a soldering unit(40) for soldering the printed circuit board, and a conveyor for transferring the printed circuit board from a preheating section to a soldering section. The conveyor has a first conveyor(60) installed in the preheating section and a second conveyor(70) installed in the soldering section and controlled independent of the first conveyor.
申请公布号 KR100776262(B1) 申请公布日期 2007.11.15
申请号 KR20060108268 申请日期 2006.11.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SUNG, BACK KI
分类号 H01L21/60;H05K3/34 主分类号 H01L21/60
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