| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high sensitivity alkali-developable photosensitive resin composition excellent in suitability to set to touch, adhesion and resolution, ensuring slight generation of gas in heat curing and giving a cured film excellent in thermal shock resistance and PCT resistance and to provide a printed wiring board which is produced using the composition and suppresses generation of gas when parts are mounted and on which a solder resist and/or a resin insulating layer excellent in cracking resistance and electric insulating property has been formed. <P>SOLUTION: The alkali-developable photosensitive resin composition comprises (A) a carboxylic resin having one or more carboxyl groups in one molecule, (B) at least one compound represented by formula (I) as a photopolymerization initiator, (C) a reactive diluent and (D) an epoxy compound having two or more epoxy groups in one molecule, wherein one or two of symbols R are represented by formula (II), the remainders are each -H, -CH<SB>3</SB>, phenyl or halogen and R<SP>1</SP>is -H, -CH<SB>3</SB>, phenyl, biphenyl or a 1-6C alkyl substituted phenyl or biphenyl. <P>COPYRIGHT: (C)2004,JPO |
