| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board that has simple processes for manufacturing the wiring board and can be manufactured at low costs, and to provide a method for manufacturing the wiring board. SOLUTION: A resin film 14 is set to be a starting material (Fig. 2 (a)). In a first process (Fig. 2(b)), the pattern of conductor layers 11 and 12 is formed by printing. In a second process (Fig. 2(c)), an insulating layer 15 is formed by printing and heating. In a third process (Fig. 2(d)), a resistance material is filled by printing. Then, in a fourth process (Fig. 2(e)), the pattern of a conductor layer 13 is formed by printing. More specifically, printing is utilized in all processes, and other methods are utilized only for heating to cure the insulating layer 15 and washing/drying. Additionally, only printers, thermosetting ovens, and the like may be used as facilities used for manufacturing. |
