发明名称 |
PRINTED BOARD AND METHOD FOR MANUFACTURING SAME |
摘要 |
<p>This invention relates to a printed circuit board which comprises a porous sheet or foil composed of a non-conductive material; a circuit pattern composed of a conductive material formed on the porous sheet or foil; and an organic polymer coating as an insulating layer formed by vapor deposition polymerization. Also this invention relates to a method for manufacturing a printed circuit board comprising a step of forming a photo-resist layer on a non-conductive porous sheet or foil; a step of forming a circuit pattern in the photo-resist layer by exposing and developing; a step of plating the circuit pattern with a conductive material; a step of removing the photo-resist layer; and a step of forming an organic polymer coating over the circuit pattern of the conductive material by means of vapor deposition polymerization.</p> |
申请公布号 |
EP1855515(A1) |
申请公布日期 |
2007.11.14 |
申请号 |
EP20060714422 |
申请日期 |
2006.02.23 |
申请人 |
SO-KEN CO., LTD |
发明人 |
KAWAKAMI, TAKASHI;SASO, NOBUYUKI |
分类号 |
H05K3/28;H05K1/11;H05K3/18 |
主分类号 |
H05K3/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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