发明名称 |
Method for producing semiconductor substrate |
摘要 |
<p>To provide a method for producing a semiconductor substrate able to uniformly and quickly fill through-holes in the semiconductor substrate with conductive material. This method comprises a process for forming through-holes (14) in a substrate (10), a process for disposing solder (42) on one surface of the substrate, and a process for pressing the solder on a side of the substrate by a press (40) and heat-melting the solder to fill the through-holes in the substrate with the solder.</p> |
申请公布号 |
EP1675445(B1) |
申请公布日期 |
2007.11.14 |
申请号 |
EP20050027678 |
申请日期 |
2005.12.16 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
KEI, MURAYAMA;MITSUTOSHI, HIGASHI |
分类号 |
H05K3/40 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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