| 发明名称 |
SEMICONDUCTOR DEVICE, LED HEAD, AND IMAGE FORMING APPARATUS |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem that cracks and peeling are generated on a semiconductor thin film due to concentration of a stress on an opening formed on an interlayer insulating film of a semiconductor thin film fixed on a substrate. <P>SOLUTION: In an edge where the opening 12 of the interlayer insulating film 30 is formed; an inclined surface 32 having an inclination angle θ is formed, and a stress is released on this inclined surface. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2007294605(A) |
申请公布日期 |
2007.11.08 |
| 申请号 |
JP20060119517 |
申请日期 |
2006.04.24 |
| 申请人 |
OKI DATA CORP;OKI DEGITAL IMAGING:KK |
发明人 |
OGIWARA MITSUHIKO;FUJIWARA HIROYUKI;MUTO MASATAKA;IGARI YUUKI;KUROKAWA HIROSHI |
| 分类号 |
H01L33/58;B41J2/44;B41J2/45;B41J2/455;H01L33/20;H01L33/30;H01L33/40;H01L33/44 |
主分类号 |
H01L33/58 |
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