| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having a highly reliable airtightness capable of achieving strong bonding between an insulating substrate and a metallized layer even in a temperature cycle environment upon usage, and preventing the peeling-off of a sealing metallized layer from the insulating substrate to sufficiently ensure the reliability of the airtight sealing. SOLUTION: A wiring board consists of a glass component 109 containing 2-8 mass% of Mn in terms of an oxide thereof, and 1-6 mass% of Si in terms of an oxide thereof, and comprises the insulating substrate 101 formed of an aluminum sintered compact whose crystal phase being Al<SB>2</SB>O<SB>3</SB>and whose grain boundary phase being MnAl<SB>2</SB>O<SB>4</SB>, and the metallized layer 104 formed on the insulating substrate 101 and containing Mo powder 107 and Mo coarse powder 108 whose mean particle diameter being larger than that of the Mo powder 107. COPYRIGHT: (C)2008,JPO&INPIT
|
