| 摘要 |
Embodiments of a solid-state camera system, particularly an imager module and an associated assembly method are described herein. Embodiments of the imager module include an optics frame configured to accommodate multiple optical channels, each optical channel comprising a lower lens group and an upper lens group. At least one of the lens groups is movable with respect to the other and to image sensors. The imaging sensors may be contained in an imager die. Embodiments further include an assembly method, including an optical configuration and method for mounting and focusing to image sensor microelectronic circuitry. Various embodiments are directed toward packaging microelectronic imagers that are responsive to radiation in the visible light spectrum or radiation in other spectrums to provide a small imager module size suitable for automated manufacture at low cost but are not so limited.
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