| 摘要 |
An apparatus and a method for packaging semi-conductor devices. The apparatus is applicable to many types of contemporary packaging schemes that utilize a sacrificial metal base strip. Tunnels (213) formed through an encapsulation area (215) surrounding the device (207) and associated bond wires (211) are filled with a metallic conductor by, for example, electroplating, and extend bottom contact pads (205) to an uppermost portion of the encapsulated area (215) . The sacrificial metal base strip (201) serves as a plating bus and is etch-removed after plating. The filled tunnels (213) allow components to be stacked in a three-dimensional configuration. |
