| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method capable of thinly and inexpensively manufacturing a double-sided package, in which the upper surface of a substrate can be optionally rewired and connection with an upper IC can be easily achieved. <P>SOLUTION: A recess is formed on a package substrate constituted of a multilayer-wired multilayer organic substrate, and an LSI chip is stored in the recess. The LSI chip connected to the multilayer wire is wired on the upper surface of sealed resin, and the wire is connected to a terminal wire connected to the multilayer wire on the front surface of the package substrate and a front surface bump electrode for external connection which is formed on the upper surface of resin. On the rear side of the package substrate, a rear surface bump electrode is formed for external connection which is connected to the multilayer wire. <P>COPYRIGHT: (C)2008,JPO&INPIT |
