| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for reducing oxidation in wire bonding. <P>SOLUTION: A wire bonding apparatus is provided. More specifically, the system relates to the delivery of a cover gas to a bond site region of the wire bonding apparatus. That is, this wire bonding apparatus includes the bond site region which holds a semiconductor element during wire bonding operation, and a gas supply line which is configured to supply the gas to the bond site region from its upper side. <P>COPYRIGHT: (C)2008,JPO&INPIT |
