| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure by which electric connection is performed without increasing thickness dimensions in an optical head device. SOLUTION: In the optical head device 1, the ground line of a light receiving element 56 for monitor and the ground line of an IC 30 for drive are electrically connected to metal foil 39 adhered to a flexible printed circuit board 3 by solder 381, 382, the metal foil 39 is brought into contact with a metal sub frame 22 to take electromagnetic wave noise prevention measures in the optical head device 1. The metal foil 39 is obtained by forming a nickel plating layer on iron foil. COPYRIGHT: (C)2008,JPO&INPIT
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