发明名称 Verbindungsstruktur für ummantelte Leitungen und Verfahren zur Herstellung einer Verbindungsstruktur für ummantelte Leitungen
摘要 A connecting structure for covered wires is provided. At first, a shield wire 1 and a ground wire 2 are prepared. After overlaying the ground wire 2 on the shield wire 1 cross each other, respective overlapping portions of the wires 1, 2 are interposed between an upper resin tip 13 and a lower resin tip 14. Next, the upper and lower resin tips 13, 14 are oscillated with ultrasonic waves while compressing the upper and lower resin tips 13, 14 from the outside. Consequently, respective outside rinds 1d, 2b of the wires 1, 2 are molten for removal, so that a braided wire 1c comes into electrical contact with a core line 2a. The upper resin tips 13 is provided, on its butt face, with a stopper 13b for defining the position of a leading end of the ground wire 2, while the lower resin tip 14 is provided, on its butt face, with a recess 14b for receiving the stopper 13b.
申请公布号 DE19909322(B4) 申请公布日期 2007.11.08
申请号 DE1999109322 申请日期 1999.03.03
申请人 YAZAKI CORP. 发明人 IDE, TETSURO
分类号 H01R4/66;B29C65/08;H01R4/02;H01R4/70;H01R9/05;H01R43/02 主分类号 H01R4/66
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