| 摘要 |
PROBLEM TO BE SOLVED: To suppress the occurrence of the damage of a solid state imaging apparatus, and suppress reduction in its transmission coefficient, and reduce the number of its processes, by forming its on-chip lenses and its shrinking layers simultaneously. SOLUTION: The forming process of the on-chip lenses of the solid photographing device 1 has a step of forming a lens material layer on a flattening film 12 present above photoelectric converting elements 21 to form lens forming patterns 13 for forming the on-chip lenses by processing the lens material layer; a step of forming a shrinking layer 14 by a heat treatment along the deformation of the surfaces of the lens forming patterns 13 to cover the lens forming patterns 13; and a step of subjecting the shrinking layer 14 and the lens forming patterns 13 to a heat treatment to deform the lens forming patterns 13 in the form of convex lenses and to form on-chip lenses 15, and for deforming the shrinking layers 14 in the form of films which are parallel with the deformations of the surfaces of the lens forming patterns 13. COPYRIGHT: (C)2008,JPO&INPIT
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