发明名称 |
Apparatus for processing a semiconductor wafer and method of forming the same |
摘要 |
A semiconductor wafer processing apparatus may include a chuck and/or a focus ring. The chuck may be configured to hold a wafer. The focus ring may be disposed surrounding a rim of the chuck. The focus ring may include a first section formed of a first material and a second section formed of a second material. The first material and the second material may have different conductivities. A method of forming a semiconductor wafer processing apparatus may include forming a first section of a focus ring from a first material, forming a second section of the focus ring from a second material having a different conductivity than the first material, combining the first and second sections to form a focus ring, and/or arranging the focus ring so as to surround a chuck.
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申请公布号 |
US2007258075(A1) |
申请公布日期 |
2007.11.08 |
申请号 |
US20070790175 |
申请日期 |
2007.04.24 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM KI-CHUL;SHIN HONG-JAE;LEE NAE-IN |
分类号 |
G03B27/52 |
主分类号 |
G03B27/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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