| 摘要 |
PROBLEM TO BE SOLVED: To provide an aluminum electroplating solution which uses dimethylsulfone as a solvent and can suppress the influence of moisture on an aluminum plating film to be produced, can obtain the aluminum plating film having no non-deposited area, and further can improve the adhesiveness of the aluminum plating film onto a sample having an L- or U-shaped cross section. SOLUTION: An organic compound having a 2,2'-bipyridyl structure as a basic structure or a derivative thereof is added to a non-aqueous solvent aluminum electroplating solution comprising dimethylsulfone and an aluminum halide to suppress the influence of electrolysis of moisture in the plating liquid on the aluminum plating film and to improve the adhesiveness of the plating film. COPYRIGHT: (C)2008,JPO&INPIT
|
