| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding equipment and bonding method which allows continuous bonding with a plurality of independent bonding tools. SOLUTION: The bonding equipment comprises a plurality of bonding tools 2 for transmitting loads and vibration to a chip 3, a lifting mechanism 7 which applies a load on the plurality of bonding tools 2 to press the chip 3 against a substrate 5, a plurality of vibrators 9 which are provided to correspond to the plurality of bonding tools 2 for applying vibration independently to the corresponding bonding tool 2, a high frequency voltage generator 21 for generating a high frequency voltage applied to any of the plurality of vibrators 9, and a connection selector 22 for selecting connection between an arbitrary bonding tool 2 and the high frequency voltage generator 21. The bonding tools 2 for applying vibration are sequentially switched for continuous bonding. COPYRIGHT: (C)2008,JPO&INPIT
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