| 摘要 |
PROBLEM TO BE SOLVED: To provide a low cost handy wafer transporting method facilitating the transport of a wafer with avoiding the contact between chips. SOLUTION: For transporting a wafer W mounted in a frame F, a fixing jig 1 for fixing a tape S to the tape S between the outside of the wafer W and the inside of the frame F is fixed to the tape W to eliminate the bending of the tape S, thereby avoiding the contact between chips T to facilitate transporting the wafer W. COPYRIGHT: (C)2008,JPO&INPIT |
