| 摘要 |
The present invention is to provide a method of manufacturing a printed wiring board with a component mounting pin to connect a printed wiring board and an electronic component A method of manufacturing a printed wiring board ( 1 ) with a component mounting pin ( 18 ) at a stage to form a component mounting surface after layers of a predetermined number were formed includes the steps of forming a conductive land ( 11 ) on the component mounting surface, covering the component mounting surface with an insulating layer ( 12 ) except the conductive land ( 11 ) of the component mounting surface, partly forming near the conductive land ( 11 ) of the upper surface of the insulating layer ( 12 ) a sacrificial layer ( 14 ) which can be removed in the subsequent process, forming conductive layers ( 16, 17 ) on the upper surfaces of the conductive land ( 11 ) and the sacrificial layer ( 14 ) with a plating process to pattern the conductive layers ( 16, 17 ), forming the component mounting pin ( 18 ) elongated from the conductive land ( 11 ) by partly removing the sacrificial layer ( 14 ) located under the patterned conductive layers ( 16, 17 ) and erecting the component mounting pin ( 18 ).
|
